Corner rounding process for partial vertical transistor

ABSTRACT

A double corner rounding process for a partial vertical cell. A first corner rounding process is performed after etching the substrate to form a shallow trench for device isolation. A second corner rounding process is performed after forming shallow trench isolations (STIs) and exposing the corner of the substrate at the active areas in the memory cell array region.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor manufacturing processand in particular to a method of forming a dynamic random access memory(DRAM) comprising deep trench capacitors and partial verticaltransistors.

2. Description of the Related Art

When manufacturing memory products such as trench-type DRAM,stacked-type DRAM and FLASH memory, in order to reduce the size of achip, the conventional semiconductor process uses self-aligned contact(SAC) technology to define a reduced distance between two adjacent gateconductive structures.

A DRAM structure comprising a trench capacitor and a vertical transistoris shown in FIG. 1. A deep trench 18 is formed in a substrate 10comprising silicon. A trench capacitor 14 is formed in the lower portionof the deep trench 18.

A diffusion region is formed in the substrate 10 between the trenchcapacitor 14 and the vertical transistor 16 as a buried strap 12. Theburied strap 12 is formed by driving the dopant in an electric layer(not shown) into the substrate 100 during a thermal process.

The trench top oxide (TTO) 24 is deposited on the upper electrode toelectrically isolate the trench capacitor 14 and the vertical transistor16.

The vertical transistor 16 comprises a source 26, a drain 12, a gateoxide layer 28, and a gate layer 20. The gate layer 22 extends from thesurface of the deep trench 18 to the substrate 100.

However, the corner 30 of the gate oxide layer 28 is usually thinnerthan the vertical sidewall of the deep trench 18 and the surface of thesubstrate 100 because of the different rate of oxidation. Thus,performance of the vertical transistor 16 is affected.

SUMMARY OF THE INVENTION

Accordingly, an object of the invention is to provide a double cornerrounding process for a partial vertical cell to avoid unacceptably thincorners of the gate oxide layer.

To achieve the above objects, the present invention provides a doublecorner rounding process for a partial vertical cell. First, a substratecomprising a memory cell array region and a supporting region isprovided. A first mask layer is formed on the substrate. A deep trenchis formed in the first mask layer and the substrate in the memory cellregion. A capacitor is formed in a lower portion of the deep trench. Afirst insulating layer is formed in the upper portion of the deeptrench, with surface lower than that of the substrate. A second masklayer is formed in the deep trench, with a surface lower than that ofthe first mask layer. A photoresist layer is formed on the active areasof the substrate, such that a first portion of the substrate, covered bythe photoresist layer, and a second portion of the substrate, notcovered by the photoresist layer, are defined. Parts of the first masklayer not covered by the photoresist layer and the second portion of thesubstrate are removed until the surface of the second portion of thesubstrate is lower than that of the first mask layer. The photoresistlayer and the second mask layer are removed. The edge of the first masklayer is then removed until the corner of the first portion of thesubstrate is exposed. A first rounding process is subsequently performedon the corner of the first portion of the substrate. A second insulatinglayer is conformally formed on the first mask layer, the firstinsulating layer, and the substrate. An insulating plug is formed on thesecond insulating layer, such that the surface of the insulating plug issubstantially level with that of the second insulating layer on thesubstrate. The insulating plug, the second insulating layer, and thefirst mask layer in the memory cell array are removed to expose thecorner of the first portion of the substrate. Finally, a second roundingprocess is performed on the corner of the substrate in the memory cellarray region.

The first mask layer comprises stacked silicon oxide and silicon nitridelayers. The second insulating layer comprises silicon nitride. As well,the insulating plug comprises silicon oxide formed by high densityplasma chemical vapor deposition (HDP CVD).

The second mask layer is an organic anti-reflection coating layer.

Removal of the edge of the first mask layer is performed by anisotropicetching, employing etching solution comprising hydrogen fluoride (HF)and ethylene glycol (EG).

The first rounding process comprises oxidizing the corner and thesidewall of the first portion of the substrate to form a sacrificialoxide layer and removing the sacrificed oxide layer. Oxidization isperformed by in-situ steam generation (ISSG).

The second rounding process is performed by employing an oxidation agentand a HF solution by turns. The oxidation agent comprises H₂O_(2(aq))and HNO_(3(aq)).

Transistors are further formed on the active area in the memory cellarray region and in the supporting region.

According to the present invention, the corner of the substrate of theactive areas in the memory cell array region undergoes double roundingto increase the curvature radius, such that the thickness of the gateoxide layer following formation is substantially equal to that of theother regions of the gate oxide layer, resulting in improved transistorquality.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention can be more fully understood by reading thesubsequent detailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 is a cross-section of a conventional structure comprising atrench capacitor and a vertical transistor;

FIGS. 2A through 2I are cross-sections of a double corner roundingprocess for a partial vertical cell according to the invention.

DETAILED DESCRIPTION OF THE INVENTION

In FIG. 2A, a substrate 100 comprising Si or Ge is provided. Thesubstrate 100 is divided into two parts comprising a memory cell arrayregion I and a supporting region II. A first mask layer 102 is formed onthe substrate 100. The first mask layer 102 comprises stacked siliconoxide and silicon nitride layers.

Next, the first mask layer 102 is patterned. The substrate 100 undergoesphotolithography and etching to form a deep trench 112 in the memorycell region I using the patterned first mask layer 102 as a shield. Acapacitor 104 is formed in a lower portion of the deep trench 112. Thetrench capacitor 104 comprises a buried plate (BP) serving as a lowerelectrode, an upper electrode 116, a dielectric layer deposited betweenthe upper electrode 116 and the lower electrode. The buried plate isdeposited in the doped region of the substrate 100 surrounding the lowerportion of the trench 112. The material of the electric layer 116comprises silicon oxide or a stacked silicon oxide/siliconnitride/silicon oxide layer. The material of the upper electrode 116comprises doped polysilicon.

A first insulating layer (collar) 114 is formed on the capacitor in theupper portion of the deep trench 112, with a surface lower than that ofthe substrate 100. A trench top oxide (TTO) 122 is subsequently formedon the first insulating 114 to isolate the upper electrode 116 and thefollowing formed transistor. The trench top oxide 122 comprisestetraethlothosilicate (TEOS).

In FIG. 2B, a second mask layer 124 is formed in the deep trench 112,recessed below the first mask layer 102. The material of the secondinsulating layer 124 comprises an organic anti-reflection coating layer.A photoresist layer 126 is then formed on the active areas of thesubstrate 100 in the memory cell array region and in the supportingregion.

In FIG. 2C, using the photoresist layer 126 and the second mask layer124 as a mask, the substrate 100 is etched to form a shallow trench 130to define the active areas (AA), such that the surface of the trench 130is lower than that of the trench top oxide 122. The photoresist layer126 and the second mask layer 124 are subsequently removed.

In FIG. 2D, the edge of the first mask layer 102 is then removed byanisotropic etching to expose the corner 150 of the substrate 100,employing an etching solution comprising hydrogen fluoride (HF) andethylene glycol (EG).

A first rounding process is then performed on the corner 150 of thesubstrate 100 as follows. The corner 150 and the exposed sidewall of thesubstrate 100 undergo in-situ steam generation (ISSG) to form asacrificial oxide layer 132, which is then removed. Thus, the roundedcorner 150 of the substrate 100 in the active areas (AA) is obtained.

In FIG. 2E, a second insulating layer 134 comprising silicon nitride isconformally formed on the first mask layer 102, the first insulatinglayer 114, and the substrate 100. An insulating plug 136 is formed onthe second insulating layer 134 by high density plasma chemical vapordeposition (HDP CVD). The insulating plug 136 undergoes chemical machinepolishing (CMP) until the second insulating layer 134 is exposed, suchthat the surface of the insulating plug 136 is substantially level withthat of the second insulating layer 134 on the substrate 100.

In FIG. 2F, a photoresist layer 142 is formed on the second insulatinglayer 134 and the insulating plug 136 in the supporting region II, suchthat memory cell array region I is exposed.

In FIG. 2C, the insulating plug 136, the second insulating layer 134,and the first mask layer 102 in the memory cell array I are removed toexpose the corner 150 of the substrate 100 in the active areas (AA). Asecond rounding process is performed on the corner 150 of the substrate100 in the memory cell array region I. H2O₂(aq) or HNO₃₍aq) is employedto form a sacrificial oxide layer on the corner 150. The sacrificedoxide layer is then removed by HF solution.

The insulating plug 136 in the memory cell array region I is removedusing the photoresist layer 142 as a shield, as shown in FIG. 2H.

The second insulating layer 134 and the first mask layer 102 aresubsequently removed to expose the substrate 100 in the active areas(AA). A gate oxide layer 152 comprising silicon oxide by oxidationformation is formed on the substrate 100. A gate layer 154 is formed onthe gate oxide layer 152, and a spacer 156 is formed on the sidewall ofthe gate layer 152. Thus, transistors are obtained in the memory cellarray region I and the supporting region II.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it is to be understood that the invention isnot limited to the disclosed embodiments. To the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

1. A double corner rounding process for a partial vertical cell,comprising: providing a substrate comprising a memory cell array regionand a supporting region and having a first mask layer thereon, wherein adeep trench is formed in the first mask layer and the substrate in thememory cell region, a capacitor is formed in a lower portion of the deeptrench, a first insulating is formed in the upper portion of the deeptrench, and the surface of the first insulating layer is lower than thatof the substrate; filling a second mask layer in the deep trench,wherein the surface of the second mask layer is lower than that of thefirst mask layer; forming a photoresist layer on the active areas of thesubstrate, such that a first portion of the substrate, covered by thephotoresist layer, and a second portion of the substrate, not covered bythe photoresist layer, are defined; removing parts of the first masklayer not covered by the photoresist layer and the second portion of thesubstrate until the surface of the second portion of the substrate islower than that of the first mask layer; removing the photoresist layerand the second mask layer; removing the edge of the first mask layeruntil the corner of the first portion of the substrate is exposed;performing a first rounding process on the corner of the first portionof the substrate; conformally forming a second insulating layer on thefirst mask layer, the first insulating layer, and the substrate; formingan insulating plug on the second insulating layer, such that the surfaceof the insulating plug is substantially level with that of the secondinsulating layer on the substrate; removing the insulating plug, thesecond insulating layer, and the first mask layer from the memory cellarray to expose the corner of the first portion of the substrate;performing a second rounding process on the corner of the substrate inthe memory cell array region.
 2. The method as claimed in claim 1,wherein the first mask layer comprises stacked silicon oxide and siliconnitride layers.
 3. The method as claimed in claim 1, wherein the secondmask layer is an organic anti-reflection coating layer.
 4. The method asclaimed in claim 3, wherein removal of the edge of the first mask layeris performed by anisotropic etching.
 5. The method as claimed in claim4, wherein an etching solution comprising hydrogen fluoride (HF) andethylene glycol (EG) is employed in anisotropic etching.
 6. The methodas claimed in claim 1, wherein the first rounding process comprisesoxidizing the corner and the sidewall of the first portion of thesubstrate to form a sacrificial oxide layer and removing the sacrificedoxide layer.
 7. The method as claimed in claim 6, wherein oxidization isperformed by in-situ steam generation (ISSG).
 8. The method as claimedin claim 1, wherein the second insulating layer comprises siliconnitride.
 9. The method as claimed in claim 1, wherein the insulatingplug comprises silicon oxide formed by high density plasma chemicalvapor deposition (HDP CVD).
 10. The method as claimed in claim 8,wherein the second rounding process is performed by employing anoxidation agent and a HF solution by turns.
 11. The method as claimed inclaim 10, wherein the oxidation agent comprises H₂O_(2(aq)) andHNO_(3(aq)).
 12. The method as claimed in claim 1, further comprisingforming transistors on the active area in the memory cell array regionand in the supporting region.
 13. A double corner rounding process for apartial vertical cell, comprising: providing a substrate comprising amemory cell array region and a supporting region and having a first masklayer thereon, wherein a deep trench is formed in the first mask layerand the substrate in the memory cell region, a capacitor is formed in alower portion of the deep trench, a first insulating is formed in theupper portion of the deep trench, the surface of the first insulatinglayer is lower than that of the substrate, and a shallow trench isformed to define active areas in the memory cell array region and thesupporting region; removing the edge of the first mask layer until thecorner of the substrate is exposed; performing a first rounding on thecorner of the substrate; conformally forming a second insulating layeron the first mask layer, the first insulating layer, and the substrate;forming an insulating plug on the second insulating layer, such that thesurface of the insulating plug is substantially level with that of thesecond insulating layer on the substrate; removing the insulating plug,the second insulating layer, and the first mask layer from the memorycell array to expose the corner of the substrate in the memory cellarray region; performing a second rounding process on the corner of thesubstrate in the memory cell array region.
 14. The method as claimed inclaim 13, wherein the first mask layer comprises stacked silicon oxideand silicon nitride layers.
 15. The method as claimed in claim 13,wherein removal of the edge of the first mask layer is performed byanisotropic etching.
 16. The method as claimed in claim 15, wherein anetching solution comprising hydrogen fluoride (HF) and ethylene glycol(EG) is employed in anisotropic etching.
 17. The method as claimed inclaim 13, wherein the first rounding process comprises oxidizing thecorner and the sidewall of the first portion of the substrate to form asacrificial oxide layer and removing the sacrificed oxide layer.
 18. Themethod as claimed in claim 17, wherein oxidization is performed byin-situ steam generation (ISSG).
 19. The method as claimed in claim 13,wherein the second insulating layer comprises silicon nitride.
 20. Themethod as claimed in claim 1, wherein the insulating plug comprisessilicon oxide formed by high density plasma chemical vapor deposition(HDP CVD).
 21. The method as claimed in claim 13, wherein the secondrounding process is performed by employing an oxidation agent and a HFsolution by turns.
 22. The method as claimed in claim 21, wherein theoxidation agent comprises H₂O_(2(aq)) and HNO_(3(aq)).
 23. The method asclaimed in claim 13, further comprising forming transistors on theactive area in the memory cell array region and in the supportingregion.